Pcb Engineering

PCB Thermal Via Array Conduction Resistance (Cylindrical Model) calculator

PCB Thermal Via Array Conduction Resistance (Cylindrical Model) engineering calculator.

Runnable This tool can run, but independent engineering verification has not been established.

Quick Answer

The pcb thermal via array conduction resistance (cylindrical model) calculator computes thermal resistance of via array from the input values you provide.

Calculator

Thermal resistance of via array (K⁄W)
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Result Interpretation

PCB Thermal Via Array Conduction Resistance (Cylindrical Model) calculator computes Thermal resistance of via array in K/W using the defined engineering formula and the input values provided. Thermal resistance of via array is expressed in K/W. No universal acceptance threshold is defined by this calculator.

Worked Example

Verified calculation

Given:

  • PCB substrate thickness between planes = 0.0016
  • Number of thermal vias in array = 12
  • Radius of a single via barrel (plated hole) = 0.00015
  • Thermal conductivity of copper plating = 390

Expected Result:

  • Thermal resistance of via array = 4.8366174538848

Engineering Interpretation:

Under the given input conditions, the calculated result is: Thermal resistance of via array = 4.8366174538848 K/W.

The actual numerical result is computed by the Runtime engine using the persisted tool definition. The values shown here come from deterministically validated test cases.

Formula / Method

thermal resistance of via array = (pcb substrate thickness between planes / (number of thermal vias in array * 3.14159265358979 * plated hole * plated hole * thermal conductivity of copper plating))

Thermal resistance of via array.

Variables

SymbolLabelRoleDescription
thickness PCB substrate thickness between planes INPUT PCB substrate thickness between planes
num_vias Number of thermal vias in array INPUT Number of thermal vias in array
via_radius Radius of a single via barrel (plated hole) INPUT Radius of a single via barrel (plated hole)
k_copper Thermal conductivity of copper plating INPUT Thermal conductivity of copper plating
result Thermal resistance of via array OUTPUT Thermal resistance of via array

Calculation Steps

  1. Enter the pcb substrate thickness between planes in m.
  2. Enter the number of thermal vias in array in 1.
  3. Enter the radius of a single via barrel (plated hole) in m.
  4. Enter the thermal conductivity of copper plating in W/(m*K).
  5. Step 1: Compute thermal resistance of via array.
  6. Read the thermal resistance of via array (K/W) from the results.

Frequently Asked Questions

What does this calculator calculate?

The PCB Thermal Via Array Conduction Resistance (Cylindrical Model) calculator estimates Thermal resistance of via array based on the input parameters you provide

Why is pcb substrate thickness between planes important in this calculation?

pcb substrate thickness between planes is directly proportional to thermal resistance of via array. When you enter pcb substrate thickness between planes in m, the calculator uses it in the engineering formula to compute the output

How should I interpret the result thermal resistance of via array?

The calculator outputs thermal resistance of via array in K/W. The result is computed directly from the input values using the defined engineering formula

What units should I use for the inputs?

Enter each value in the units shown next to the input field: PCB substrate thickness between planes (m), Radius of a single via barrel (plated hole) (m), Thermal conductivity of copper plating (W/(m*K)). Make sure all inputs use the specified units for consistent results

What assumptions does this calculator use?

This calculator uses automatically validated engineering formulas. Results are approximate and should be validated against site-specific conditions, applicable codes, and professional engineering judgment

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